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Yi Liu is a seasoned engineering professional with significant expertise in RF SiP packaging design, process development, and new product introduction, currently serving as Director of Engineering at Skyworks Solutions, Inc. since February 2014. With a strong background at Intel as a Senior Process Engineer and at Motorola as a Process Engineer, Yi Liu has developed a nuanced understanding of package architecture, reliability testing, and the interaction between materials and assembly processes. Educational qualifications include a Ph.D. in Electrical and Computer Engineering from Auburn University and two degrees in Mechanical Engineering from Tianjin University.