Eric Wickesberg is an experienced Etch Process Engineer at Polar Semiconductor, LLC since June 2014, with a diverse background in semiconductor manufacturing. Prior experience includes roles as Integration Engineer at GLOBALFOUNDRIES, where Eric coordinated interconnect-module qualification during the startup of a greenfield semiconductor fab, and as Yield/Integration Engineer at Intel, where essential yield loss mechanisms were identified and new production methodologies developed. Eric has a comprehensive history in the semiconductor industry, including various roles focused on dry etch processes and yield enhancement at Intel, along with an internship at IBM's ADSTAR. Eric holds a Master’s degree in Electrical Engineering and a Bachelor’s degree in Applied Mathematics, Engineering and Physics from the University of Wisconsin-Madison.
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