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Pragnesh Patel is a Principal Field Application Engineer at NXP Semiconductors since August 2022, focusing on upgrading printing and RFID technologies to Wi-Fi6 and implementing Bluetooth use cases for public safety devices. Previously, as Field Application Engineer Manager at Amphenol Mobile Consumer Products, Patel collaborated with the business development team on antenna distribution. Experience as a Senior Field Application Engineer and Field Application Engineer at Airgain, Inc. involved working with federal agencies on HPUE modem trials and identifying new market opportunities. Prior roles included Systems Engineer at Spirent Communications, where testing Wi-Fi systems for major clients was key, and System Integration and Test Engineer at Qualcomm, studying MU-MIMO technologies. Educational background includes a Master of Business Administration from the University of Wisconsin-Eau Claire, a Master’s Degree in Electrical Engineering from San Diego State University, and a Bachelor's Degree in Electrical, Electronics, and Communications Engineering from Charotar University.