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David Lacombe has extensive work experience in the field of semiconductor design and engineering. David is currently working as a Senior Principal Design Engineer at MACOM since March 2022. Prior to this, they worked at R2 Semiconductor, Inc. for almost a decade, starting in March 2013, where they held the position of Chip Lead and Senior Member of Technical Staff.

Before joining R2 Semiconductor, Inc., David worked at Microsemi for over ten years. David held the role of Principal Analog Design Engineer and was responsible for leading circuit design and project teams to develop and release high-performance analog power management controllers used in various technologies. David played a significant role in generating over $100M in revenue over a ten-year period for a specific product line.

David'searlier experience includes working at Texas Instruments (acquired Silicon Systems) as a Senior Staff Design Engineer for eight years. David designed and released high-performance BiCMOS preamplifiers for the hard disk drive and removable storage industry. During their tenure, they successfully developed nine new high-volume products and defined process technology requirements for preamplifier products.

David's career started at TRW LSI Products, where they worked as a Senior Design Engineer for seven years. David specialized in developing high-performance data converters, including high-resolution, high-speed D/A converters and video speed flash ADCs.

Overall, David Lacombe has a strong background in semiconductor design and engineering, showcasing their expertise and leadership skills in the industry.

David Lacombe's education history is not available.