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FlipChip International, LLC
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FlipChip International is a world leading WLCSP bumping supplier, with wafer dicing and thinning capabilities, ASIC, ASPP and ASSP design, and a complete IC service from design to packaging.
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Bob Forcier
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Tony Curtis
R D And Reliability Engineering Manager
Dawn Cuevas
Human Resource Manager
Dejen Eshete
Director Of Quality, Reliability And Supply Chain Management
David Lawhead
Engineer
David Pigeon
Manufacturing Technician
Gary Chapman
Associate Process Engineer
Jeff Hicklin
Test Production Engineer
Jose Garcia
Equipment Technician
Larry Shelby
Manufacturing Technichan
Nova Sihatay
Process Technician
Ray Lawrence
Process Engineer
Rudycarrillo: Hotmail.com
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Steven Ostroski
Process Engineer
