The Engineering Team at FlipChip International is responsible for developing and optimizing advanced wafer-level chip scale packaging (WLCSP) processes, ensuring efficient manufacturing operations, and maintaining and improving equipment reliability. This multidisciplinary team collaborates on process design, equipment maintenance, and production testing to deliver high-quality IC services from design through to packaging, ultimately driving innovation and efficiency in semiconductor manufacturing.
Chris Stalzer
Equipment Engineer III
David Pigeon
Manufacturing Technician
Eric Zhang
Process Engineer
Gary Chapman
Associate Process Engineer
Jeff Hicklin
Test Production Engineer
Jose Garcia
Equipment Technician
Nova Sihatay
Process Technician
Ray Lawrence
Process Engineer
Steven Ostroski
Process Engineer
William Fry
Equipment Engineer
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