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Ray Lawrence has over 30 years of experience in the semiconductor industry, specializing in process engineering. Currently serving as a Process Engineer at FlipChip International since November 2009, Ray focuses on wafer thinning and backgrind processes, as well as plasma cleaning. Previously, Ray worked at Freescale Semiconductor for 12 years, where responsibilities included PECVD, ion implantation, and various wafer fabrication techniques. Earlier in the career, Ray was a Packaging Process Engineer at Motorola Semiconductor, specializing in hermetic packaging and assembly processes. Ray holds a Bachelor of Science degree in Mechanical Engineering from Arizona State University, earned in 1999.