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Rajdeep Bondade is a Principal Engineer at Analog Devices since October 2022, with prior experience as a Design Engineer at Texas Instruments from June 2016 to October 2022, focusing on Kilby Labs. Rajdeep served as a Senior Design Engineer at Intersil from March 2014 to June 2016, specializing in analog circuit design and IC bench testing for both the Mobile/Hand-held and Industrial/Infrastructure Business units. Rajdeep began academic contributions as a Post-Doctoral Research Associate and Research Assistant at the University of Texas at Dallas from August 2010 to February 2014. Rajdeep’s early experience includes a Design Engineering Intern role at Texas Instruments in 2009. Educational qualifications include a Ph.D. in Electrical and Electronics Engineering from The University of Texas at Dallas (2010-2013), and a Bachelor of Engineering in Electronics and Communication from Visvesvaraya Technological University (2003-2007).