ÂÜÀòÂÒÂ×

Andrew Thompson has over 25 years of experience in the microelectronic and optoelectronic component packaging industry. Andrew is currently working as a Sr Principal Package Engineer at Allegro MicroSystems since September 2022. Prior to this, Andrew held various positions at different companies, including serving as a Director at MULTILASE, Chief Operating Officer at Heyday Integrated Circuits, and Director at COLURA LTD. Andrew also worked at Optocap Ltd as a Technical Sales Manager and Project Manager, and at e2v as a Packaging Engineer. Andrew started their career at Agilent Technologies (formerly HP) as a Senior R&D Engineer. Andrew has a wide range of expertise in package design, product research, engineering, and consultancy.

Andrew Thompson completed their Bachelor of Science (BSc) degree in Physics with Optoelectronics at The University of Salford from 1994 to 1997.