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Don Richmond 2nd has an extensive background in the semiconductor industry, with experience in engineering management, technology development, and integrated circuit assembly. Don co-founded ChipScale, specializing in wafer level packaging technology and chipscale packaging for ICs & Discretes. Don also managed a team at Lam Research for the design of CVD processing equipment. Additionally, Don was the President of TEAM Holdings LTD. and a Systems Engineering District Manager at Hewlett-Packard Company. Don's engineering career began at Signetics Corp as a Design Engineer, where Don specialized in microprocessor compatible analog products and received international recognition for their work. Don holds a BSEET in Electrical Engineering from DeVry Institute.