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Tariq Butt is the current Director of Engineering at Xekera Systems. Tariq has over 20 years of experience in engineering and management, with a focus on advanced manufacturing technologies. Tariq has previously worked for companies such as Retix and Intel Corporation / Xircom.

Butt's experience in industrial engineering began at Retix, where they were responsible for directing and managing the introduction of surface mount production, as well as improving the process of an existing sub-contractor. Tariq also managed the team that justified the elimination of board washing using no-clean-flux. In addition, they headed the team that relayed the production floor using JIT philosophies, which resulted in reduced work in process (WIP) by 22% and lead time by 1.5 days. Tariq also eliminated the stockroom and moved material at point of use using Kanban and JIT philosophies.

At Intel Corporation / Xircom, Butt was responsible for managing the EOL Finish area for timely delivery and transfer of technology for their platforms. Tariq also worked with yield and other modules to define a yield improvement roadmap and implement it. In addition, they managed Manufacturing Systems for Wafer & Die Prep (Backgrinding, Wafer Mount, Wafer Saw, and Tape & Reel Die Sort), CAM & Epoxy area. This included defining business processes, coordinating CRDs, FMEAs, test cases, gap analysis, ULT (unit level traceability) challenges, collateral management, and automation integration. Tariq also managed teams to identify and drive leading edge technologies from initial ramp to high volume manufacturing, quality improvement, TPT & cost reductions, product introductions, and managing HVM product health.

In their role as Platform Lead / Manager at Advanced Manufacturing Technologies, Butt was responsible for coordinating the introduction of new products to Penang facility. Tariq also assisted them in running legacy products on new links & upgrading legacy links. In addition, they worked with IE group for capacity analysis. Tariq was also responsible for technical & financial analysis on affordable advanced substrate technologies for up-coming PC Card (formerly PCMCIA) products. This included environment friendly lead free initiative, use of Organic solderability preservative (OSP), micro, blind & buried vias, higher tg dielectric surface finishes for higher frequency wireless products, trace width & space.

Butt has also managed subcontractors (PCB-houses & Electronic Contract Manufacturer). Tariq has worked with them on their yields for improved costs and monitored their progress against schedule. In addition, they have headed the Design for Manufacture & Assembly (DFM & DFA) teams & assisted product development team (PDT) to introduce cost effective, manufacturable, and testable products. Tariq has also helped define technology roadmap. Performed Technology & System Gap Analysis. Assessed challenges and identified issues & solutions to achieve scaleable & capable process & project objectives, timely & efficiently.

Butt was also

Tariq Butt has a Master's Degree in Engineering/Industrial Management from California State University, Northridge and a Bachelor's Degree in Mechanical Engineering from NED University of Engineering and Technology.

Tariq Butt reports to Salman Mirza, CEO. Karuna Rudresh - Hardware-Firmware Engineer, Syed Nabeel Khan - Hardware Engineer report to Tariq Butt. Some of their coworkers include Aasim Rizvi - Wireless Connectivity Architect, Ron Miller - Relationship Manager Sales.