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Scott Wilson is a seasoned packaging engineer with extensive experience in the industry, currently serving as a Senior Packaging Engineer at Woodstream Corporation since March 2008. Prior to this role, Scott held packaging engineering positions at Baldwin Hardware Corporation, Celestica, Hewlett-Packard, Lexmark, and DuPont Pharmaceuticals. Scott's academic background includes a Master’s degree in Packaging Engineering from the Rochester Institute of Technology and a Bachelor’s degree in Mathematics from SUNY Geneseo.