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Yusheng Lin is an accomplished engineering professional with extensive experience in package engineering and process development. Currently serving as Senior Director of Process Development Engineering at Wolfspeed since September 2022, Yusheng has previously held senior leadership roles at onsemi, where responsibilities included leading wafer-level technology development, power module development, and various package engineering initiatives from 2007 to 2022. Prior to onsemi, positions at TE Connectivity and Foxconn involved driving advancements in system-in-package technologies for RF and power amplifier applications. Yusheng's career began at ASE Group Global, focusing on BGA technology development, and includes early research experience in chemistry at Academia Sinica in Taiwan, specializing in liquid crystal molecular and polymer research.