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He has successively served as the senior R&D engineer of AMD, the product project manager of digital-analog mixed-signal chips of LSI Logic, and the R&D manager of RF integrated circuits of Mobilink Telecom.

In 2000, he served as the vice president of product development of LinkAir Company. In 2002, he was appointed by Linkair Company of the United States to China to organize the company's product center Shanghai Yulian Communication, and served as the executive vice president. In 2003, he served as the vice president of Beijing Zhongxing Microelectronics and the general manager of Shanghai Pudong Microelectronics.

In 2004, he founded Miya Microelectronics (Shanghai) Co., Ltd. in Zhangjiang, serving as the chairman and president. In October 2012, the company was awarded the CleanTech Global 100 by Cleantech Group, and won the 2012 Asia Pacific Annual Award. It is the main research and development enterprise of China's smart grid core chips.

In October 2013, the company's low-voltage power carrier communication chip used in smart grid won the third prize of Shanghai Science and Technology Award and the second prize of Pudong New Area Science and Technology Progress Award.