Gopinathan Balakrishnan is a highly experienced professional in semiconductor packaging and design, currently serving as a Senior Manager at Western Digital since September 2014, where responsibilities include leading semiconductor package development for new ASICs and hybrid packaging. Prior to this role, Gopinathan worked at Open-Silicon as a Manager and Lead Engineer in semiconductor package design, focusing on ASICs and supporting manufacturing processes. Earlier career highlights include positions at Alliance Semiconductor, SPEL Semiconductor Ltd, STATS ChipPAC, and SPEL, where Gopinathan developed expertise in process engineering and assembly. Gopinathan holds a Bachelor's degree in Electronics and Communication Engineering from Madurai Kamaraj University.
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