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Outi Rusanen is a highly experienced engineering professional with a strong background in interconnection technology and failure analysis. Currently serving as Principal Interconnection Specialist at TactoTek since December 2017, Outi has contributed to the development of Injection Molded Structural Electronics (IMSE) and has recorded comprehensive technical documentation. Prior experience includes roles as Principal Engineer at Huawei Technologies, where material and physical failure analysis for hardware reliability was performed, and as Senior Manager at both Microsoft and Nokia, focusing on non-functional product requirements and process improvements. Outi's career began at VTT, managing European research projects in electronics packaging and manufacturing. Educational credentials include a Doctor of Technology and Licentiate in Engineering from the University of Oulu, along with a Master's degree in Electrical and Electronics Engineering.