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Jinglong Li is a seasoned professional in the semiconductor industry, currently serving as MTS at SMIC Americas since April 2002, providing field application engineering support for US customers in IC manufacturing, and managing customer accounts for 300 mm processes. Additionally, Jinglong holds experience as a Principal Engineer at SMIC Americas, focusing on the 200 mm 0.13 µm Cu CMP process. Prior to this role, Jinglong worked as a Development Engineer at EBARA Technologies, Inc., where responsibilities included the development of various CMP processes for Cu, W, oxides, and STI. Jinglong's academic background includes a PhD in Materials Engineering from Auburn University and a BSc in Semiconductor Physics from Sichuan University, along with studies at Tohoku University.