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Ayslan Marques currently serves as Product Engineering Manager at SMART Modular Technologies, where previous roles included Product Engineering Supervisor, RnD IC Packaging Specialist, and RnD IC Packaging Jr Engineer, starting in March 2013. Prior experience includes a position as Digital IC Functional Verification Engineer (Trainee) at Wernher von Braun Advanced Research Center in January 2013 and participation in the IC Brazil Program 2012, focused on various aspects of digital IC design and verification. Additional experience includes a trainee role at CTI Renato Archer and a trainee position at Caixa Economica Federal. Ayslan Marques holds a Bachelor of Engineering in Computer Engineering and Microelectronics from Universidade Potiguar and has completed advanced training in leadership at FIA Business School.