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Jiho Kang has extensive work experience in the semiconductor industry. From 2006 to 2020, Kang worked at Intel Corporation in various roles, including BEOL Etch Process Module Group Leader, BEOL Etch Process Engineer, TSV Etch Process Engineer, and FBE Etch Process Engineer. In 2020, Kang joined SK hynix as a Research Fellow, Head of Wafer Bonding in the R&D Division. Later, Kang was promoted to Vice President, Head of C&C Process in the R&D Division.

Jiho Kang earned a Bachelor of Science degree in Metallurgical Engineering from Yonsei University in 1998. Following that, they pursued a Master's degree in Materials Science and Engineering at Korea Advanced Institute of Science and Technology from 1998 to 2000. Jiho furthered their education by obtaining a Ph.D. in Materials Science and Engineering from The Ohio State University from 2000 to 2006.