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Bob Fabinski is a skilled microelectronics engineer with extensive experience in lithography and photolithography processes. Currently employed at SiMPore since July 2021, Bob previously worked at ON Semiconductor from May 2014 to July 2020, where expertise was applied in optimizing UV expose tools and improving manufacturing yield and cycle time. Prior to that, Bob served as a manufacturing lithography engineer at Truesense Imaging, Inc., focusing on photoresist lithography for image sensor production. Additional experience includes engineering roles at Eastman Kodak and IBM, where Bob contributed to semiconductor lithography and ceramic package manufacturing. Bob holds a Bachelor of Chemical Engineering from Manhattan University and has completed graduate studies in Materials Science at Columbia University.