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Smit Patel is an ASIC Physical Design Engineer at SignOff Semiconductors since September 2022, specializing in the field of electrical and computer engineering. Prior to this role, Smit served as a QC and System Engineer at VINROX TECHNOLOGIES LLP from August 2019 to January 2021. Smit holds a Master of Engineering (MEng) in Electrical and Computer Engineering from the University of Windsor, completed in July 2022, and an undergraduate degree in Electronics and Communication from G H Patel College of Engineering & Technology, obtained in 2019.