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Roman LE CHENADEC

Firmware Engineer at Sencrop

Roman LE CHENADEC has worked as an engineer in various roles since 2018. Roman began as a Stage Ingénieur R&D at Tibot Technologies in 2018. In 2020, they took on the role of Projet de fin d’études - Ingénieur R&D at BA Healthcare. In 2021, they became an Ingénieur Développeur Logiciel Embarqué at XEE. Currently, they are a Firmware Engineer at Sencrop since 2022.

Roman LE CHENADEC obtained their Diplôme d'ingénieur in Electronique et Informatique Industrielle from INSA Rennes between 2014 and 2020. In 2018, they also attended Aalto University.

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