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Skyler Sandlin is a highly experienced Failure Analysis Engineer currently at Polar Semiconductor since August 2021, utilizing advanced semiconductor testing tools and techniques while analyzing manufacturing and field return failures. Previously, Sandlin held positions such as Microelectronics Engineer at Northrop Grumman, where product flow management in a compound fabrication environment was prioritized, and an undergraduate research assistant at the University of Wisconsin-Milwaukee, focusing on nanowires and transition metal dichalcogenides. Internship experiences include roles at Samsung Austin Semiconductor in photolithography process engineering and TCI, LLC, involving electrical engineering tasks and product development. Sandlin has a background in co-owning Adaptable Manufacturing Solutions and extensive technical engagement at various levels, supported by a Bachelor’s Degree in Electrical Engineering and Physics from the University of Wisconsin-Milwaukee.