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Roderic Dulay is an experienced engineering manager currently serving as the Assembly Engineering Manager at Navitas Semiconductor since February 2019, specializing in subcon management. Prior to this role, Roderic held various engineering positions at STMicroelectronics Sdn. Bhd., where responsibilities included leading teams in transferring new technologies from design to production, with notable recognition as a Corporate Star Gold Awardee in 2015 for a low-cost wirebonding solution. Roderic’s career began in 1995, accumulating extensive experience in wirebond technology and process engineering across multiple semiconductor companies, including Hana Semiconductor and Amkor Technology. Roderic holds a Bachelor's degree in Electrical, Electronics and Communications Engineering from Mapúa University.