Multibeam has re-innovated e-beam lithography to enable cost-effective production of leading-edge semiconductors for advanced packaging, photonics, rapid prototyping, and other special applications. 

It is the industry’s only maskless multi-column e-beam platform that offers full-wafer direct write patterning capabilities with fine resolution in a modular architecture that is optimized for scale. The fully automated system features multiple miniaturized e-beam delivery columns and advanced algorithms that enable precision patterning with fab-level productivity. 

Innovated by patterning and wafer fab equipment experts, our systems empower IC leaders to make patterns that are impossible, difficult, or too expensive for mask-based solutions, with breakthrough time-to-market advantages.

Semiconductor

Multibeam Corporation

Ken MacWilliams

Mike Baker

Roger Van Art

The Engineering Team at Multibeam Corporation is responsible for developing and optimizing the company's revolutionary e-beam lithography platform. This multidisciplinary team combines expertise in systems control, mechanical design, software development, and electrical engineering to create high-precision, automated solutions for semiconductor manufacturing. Their work involves integrating multiple miniaturized e-beam delivery columns with advanced algorithms, ensuring the system's modular architecture scales effectively while maintaining fine-resolution patterning capabilities.

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Engineering Team

About

Team members

Other teams at Multibeam Corporation

Leadership Team

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