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Ray Stits has over 25 years of experience in the technology industry. Ray began their career in 1992 as a Research/Teaching Assistant at Loyola Marymount University. In 1994, they became a Research Assistant at the New York State Center for Advanced Technology in Automation, Robotics, and Manufacturing. In 1996, they joined Qualcomm as a Senior Director of Engineering. In 2017, they became the President of Stits Technologies LLC, where they consulted in the areas of Technology Strategy, Systems Architecture, Rapid Product Development, Organizational Development & Leadership. Ray also took on roles at Emcraft Systems as the Director of Hardware Engineering and at ModalAI as the VP of Hardware Engineering. At ModalAI, they were responsible for managing Electronic hardware development from concept through production, developing key partnerships with vendors for design, sourcing, and production of electronics, and leveraging knowledge in PCB technologies, component supply chain, electronic design, and manufacturing, and test to ensure successful product delivery to customers.

Ray Stits holds a Master of Science degree in Electrical Engineering from Rensselaer Polytechnic Institute, an Executive Perspective for Scientists and Engineers degree from UC San Diego, and a Bachelor of Science degree in Electrical Engineering from Loyola Marymount University.