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Vince Buffa is currently serving as the Chairman at HDT Global and Micross Components. Vince has extensive experience in the aerospace and defense industry, with previous roles as President & CEO at HDT Global and CEO & President at Data Device Corporation. Additionally, Vince has held leadership positions at companies such as Rexnord, Honeywell, and Smiths Aerospace. Vince holds an MBA in Finance from Hofstra University and a BEEE in electrical engineering from Manhattan College.