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Larry Smith is a Principal Signal Integrity Engineer at Micron Technology, specializing in Power Integrity since August 2018, where responsibilities include providing clean power solutions for all products. Previously, Larry served as a Signal and Power Integrity Principal Engineer at Qualcomm from September 2011 to June 2018, focusing on quantifying the maximum transient current a PDN can deliver with acceptable voltage droop. At Altera, Larry held the position of Signal and Power Integrity Architect from August 2005 to August 2011, overseeing all aspects of signal and power integrity and optimizing FPGA products for cost and performance. Larry began a career as a Senior Engineer at Sun Microsystems from January 1996 to August 2005, contributing technical insights and developing original concepts for power integrity. Larry holds a Bachelor of Science in Electrical Engineering from the Rose-Hulman Institute of Technology and a Master of Science in Material Science from the University of Vermont.