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Rodney Smedt is an established engineering leader with extensive experience in the semiconductor industry. Currently serving as Vice President of Engineering for Broad Band Plasma Wafer Inspection at KLA since February 2022, Rodney Smedt oversees all engineering functions related to advanced wafer inspection technologies. Prior roles include Senior Vice President and General Manager at Onto Innovation, where Rodney Smedt managed the Metrology Business unit, and Senior Vice President of R&D at Nanometrics, responsible for thin film metrology capital equipment. Additional experience includes leadership positions at ReVera Incorporated, Therma-Wave, Sensys Instruments, and KLA-Tencor, where Rodney Smedt contributed to innovative product development and engineering management. Rodney Smedt began a career in engineering at Mechanization Associates as a Senior Mechanical Design Engineer after earning a degree from San Jose State University.