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Paul Landini is an experienced Electrical Engineer currently employed at Integration Innovation, Inc. since August 2021, specializing in root-cause failure analysis on PCBs and high-density PCB design using Altium. Previous experience includes work at Tiger Innovations, where Paul engaged in both digital and analog PCB design for various aerospace applications. Paul also contributed to research at the University of Virginia, focusing on driver circuit design for infrared laser systems and electron behavior in graphene structures. Additional experience includes a summer internship at the U.S. Naval Research Laboratory, where Paul analyzed and processed images from the STEREO A spacecraft. Paul holds a Bachelor of Science degree in Physics, awarded with High Distinction from the University of Virginia in 2018.