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Pia Tolstrup Pedersen

Engineer In Raw Material & Alignment at Hempel A/S

Pia Tolstrup Pedersen is an experienced engineer with a strong background in materials and formulations. Currently at Hempel A/S since March 2001, Pia has held multiple roles including Engineer in Raw Material & Alignment, Specialist in Formulation Support & Principles, and Coating Test Specialist in the Test Department. Prior to this, Pia worked as an Engineer at Ferroperm Piezoceramics A/S from January 1998 to March 2001 and served as a Project Coordinator at the Technical University of Denmark from January 1996 to August 1997. Additionally, Pia gained valuable experience as a Visiting Researcher at NTNU and as a Research Assistant at Chimie ParisTech in 1994. Pia holds a Master of Science (M.Sc.) in Engineering from the Technical University of Denmark, completed in 1994.

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