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Gary Banks CRL has over 25 years of experience in the semiconductor and chemical industries, currently serving as the Manufacturing Leader for NextGen Finishing at Hemlock Semiconductor. In this role, Gary manages mechanical integrity and predictive maintenance technologies, focusing on vibration analysis, lubrication, infrared inspection, and other critical maintenance programs. Previous positions at Hemlock Semiconductor include E/I Reliability Engineer and Finishing Area Reliability Engineer, where Gary played key roles in the startup and commissioning of new processes and systems. Prior to joining Hemlock, Gary worked as a Vibration Analyst at Dow Corning and began a career in the US Navy as an Electrician's Mate, gaining essential skills in power distribution and nuclear power operations. Gary holds a Bachelor of Science degree in Electrical Engineering from Saginaw Valley State University.