Mario I. is currently working as the Director of Global Package Development and Engineering at Godiva Chocolatier. Prior to their current role, Mario held the position of Regional Package Development & Engineering Manager at pladis Global. Mario has extensive experience in packaging engineering, having worked as a Packaging Engineering Manager at Godiva Chocolatier and as a Packaging Engineer at K'NEX Industries. Mario also has experience as a Project Engineer at Skee Ball, Inc. Mario holds a Masters in Business Administration from Alvernia University and a BS in Mechanical Engineering from Florida State University.
Sign up to view 3 direct reports
Get started