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Ryan Lai, Ph.D., serves as the R&D Section Manager at Delta Electronics since October 2011, focusing on global technical marketing of advanced packaging products and leading international collaboration efforts in product development across the EU, US, and China. With expertise in System-in-Package (SiP) and Intelligent-Power-Module (IPM) technologies, Ryan oversees a team of researchers to innovate next-generation packaging solutions. Prior to this role, Ryan was a scientist at Ruhr University Bochum, conducting interdisciplinary research on MEMS wafers. Ryan holds a Ph.D. in Materials Science from IFW Dresden and an MPhil and B.Eng. in Electronic Engineering from The Chinese University of Hong Kong.