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John Erickson Talain is an experienced Solutions Architect at Deca Technologies, specializing in integrated circuit (IC) package design using M-Series Adaptive Patterning Technology since November 2021. Prior to this, John served as an IC Package Design Engineer at NEPES Corp., where responsibilities included the development of IC package design layouts and detailed drawings, as well as managing design workflows with Oracle Agile PLM. John has extensive experience in integrated circuit design, having held a similar role at Deca Technologies from 2011 to 2019, where work involved collaboration with various engineering teams to optimize designs for cost, manufacturability, and reliability. Additional experience includes positions in process engineering, CAD instruction, and an internship in telecommunications. John holds a Bachelor of Science in Electronics and Communications Engineering, with a focus on Robotics Technology, from the First Asia Institute of Technology and Humanities.