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Chukwudi Okoro, PhD, CRE, is an experienced research professional currently serving as a Senior Research Scientist at Corning Incorporated since October 2016, focusing on reliability studies. Previously, at the National Institute of Standards and Technology (NIST) from April 2011 to May 2016, Chukwudi was involved in IC package reliability engineering and was a key contributor to pioneering research in 3D integrated circuit reliability. Chukwudi's academic background includes a Ph.D. in Mechanical Engineering from KU Leuven, an M.Sc. in Microsystems Integration Technology from Chalmers University of Technology, and a B. Eng. in Materials and Metallurgical Engineering from the Federal University of Technology, Owerri, Nigeria.