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Clark brings over 30 years of technical engineering experience in the thick film industry to the company. His background includes the manufacturing of sophisticated multilayer substrates, etched fine line circuits for microwave frequencies and the use of photo-imaged dielectrics in miniature multilayer applications. Clark is also very experienced in substrate circuit layout and advanced process development, including processing of printed, etched and photo imaged materials on a variety of ceramics including aluminum oxides, aluminum nitride, glass and others.