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Keng Yuen Au has extensive work experience in the field of advanced packaging and microelectronics. Keng Yuen is currently working as a Senior Engineer III at the Institute of Microelectronics since 2022. Prior to this, they worked at Apple as an R&D Engineer from 2017 to 2022.

Before joining Apple, Keng Yuen Au served as a Senior Engineer II (Principal Engineer equivalent) at the Institute of Microelectronics from 2013 to 2017. In this role, they were responsible for process development and leading projects related to Cu Pillar 28nm Large Die TCB/NCP and C2/CUF. Keng Yuen worked closely with industrial players to enable large 28nm die assembly using TCB/NCP process and developed proprietary TCB know-how. Keng Yuen also served as a Co-Lead for the Rugged Electronics Team, focusing on serving Aerospace and Oil and Gas companies.

From 2005 to 2012, Keng Yuen Au worked at UTAC as a Principal Engineer. Keng Yuen played a crucial role in managing and driving TCB-NCP process, setting up 28nm TCB process capability, and multiple die TSS stacking using TCB-NCP/NCF process. Keng Yuen also led the establishment of TSS capability, defined UTAC corporate TSS and TCB roadmap, and conducted package qualification for new and existing customers. Additionally, they played a key role in setting up and qualifying flip chip packages (FCCSP/FCBGA) for mass production and material BOM paper benchmarking & selection.

Prior to UTAC, Keng Yuen Au worked as a Senior Engineer at Infineon Technologies from 2002 to 2005. Keng Yuen was part of the pioneer team responsible for setting up the first Flip Chip Mass Production Line in Singapore. Keng Yuen was involved in the integration project procurement, conceptualization, design, and implementation of intelligent Multiple Datacon/BTU oven integration. Keng Yuen also performed processability and manufacturability evaluation on machines in order to ensure successful ramp-up of flip chip packages.

Keng Yuen Au started their career at Carsem in 1999 as a Senior Engineer. Keng Yuen played a pivotal role in pioneering flip chip on leadframe (FCOL/FC-QFN/MLP), flip chip hybrid module, and low pin count FCCSP/FCBGA. Keng Yuen established design rules for new packages and developed processes and packaging methods for flip chip products.

Overall, Keng Yuen Au's work experience highlights their expertise in advanced packaging technologies, process development, and project management.

Keng Yuen Au pursued their Bachelor of Science (BSc) degree in Computer Engineering at the University of Oklahoma, Norman from 1996 to 1998.