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Ray Ciferno has extensive experience in corporate strategy, business development, and operations within the semiconductor and technology sectors. Currently serving as the Corporate Director for Advanced Packaging at ASM since 2005, Ray Ciferno has established key partnerships and led initiatives to align advanced packaging with customer needs. Previous roles include leading a global team at ASM to manage the relationship with Intel Corporation, enhancing revenues through innovative semiconductor materials, and driving operations as Vice President of Operations at Akustica. Ray Ciferno has also held leadership positions at Marconi, Varian Semiconductor, and Intel Corporation, focusing on business development and management across various technical landscapes. Educationally, Ray Ciferno holds an MBA in Strategic Planning and Finance from the University of Pittsburgh and a BA in Accounting and Finance from Washington & Jefferson College.