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Ali Davoodabadi is a seasoned engineer specializing in thermal management and materials science. Currently a 3D IC Packaging Pathfinding Engineer at TSMC, Ali has previously held roles such as Electronics Assembly R&D Engineer at Universal Instruments Corporation, where expertise in solder thermal interface material analysis was developed. Academic experience includes postdoctoral research at the University of Michigan and the University of Houston, focusing on solar energy systems and radiative heat transfer. Ali also served as a Graduate Research Assistant at Binghamton University, conducting significant research on lithium-ion battery technologies, and has experience as an instructor in thermodynamics. Educational qualifications include a Ph.D. and an MS in Mechanical Engineering from Binghamton University and post-doctoral degrees from the University of Michigan and the University of Houston.