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Philippe Muller is an experienced technology professional currently serving as a Technology Scout at SUSS MicroTec since August 2023. Previously, Philippe held roles at Huawei Technologies Research and Development Belgium NV as a 3D integration R&D engineer, focusing on 3D heterogeneous assembly for 5G and Cloud Computing applications, and at Sofradir and Sagem Defense et Securite as a packaging engineer and Ingenieur hybridation, respectively, where responsibilities included hybrid integration of components, technology stabilization, and flip-chip technology development. Philippe's career began as a process development engineer at IMEC vzw, specializing in RF IPD stabilization and various project developments, and included a tenure as an RF MEMS design engineer at THALES Research and Technology while pursuing a Ph.D. in Microwave and Microtechnology from the University of Lille 1 Sciences and Technology, where also obtained a Master of Science in microwave propagation and microtechnologies. Additionally, Philippe holds a Master's degree in Microelectronics from the Institut supérieur d'électronique et du numérique.