ÂÜÀòÂÒÂ×

Bilal K possesses extensive experience in packaging and engineering, currently serving as a Packaging Principal Architect at Solidigm. Previously, Bilal K held the position of Packaging Principal Engineer at Intel Corporation. Additionally, Bilal K has demonstrated expertise as an Operational Excellence Manager at TAMER and as a PCB Design Manager at Dover Corporation. Bilal K also served as a Senior Engineering Manager at Intel Corporation, showcasing a strong background in both management and technical roles within leading technology companies.