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Lia Karampasi is a Vertical Integration Engineer specializing in New Product Introduction at SMART Photonics since December 2023. Previously, Lia held the position of Process Engineer at ITEC from November 2022 to November 2023, and worked as an Employeneur at TMC in New Product Introduction from May 2019 to November 2023. Lia's experience includes serving as an Electroplating Process Scientist at Besi Netherlands B.V. from February 2021 to October 2022, where key projects involved standardizing plating line machines and specializing in electroplating process simulation. Additionally, Lia was a Wafer Bonding Process Engineer and Cluster Leader at Philips Innovation Services from May 2019 to January 2021, focusing on the standardization of wafer bonding processes and facilitating communication between operations and development. Lia started as a Research Assistant at Eindhoven University of Technology for a four-month traineeship in early 2019. Lia holds a Master of Engineering in Materials Science and Engineering from the University of Ioannina, earned between 2012 and 2018.