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Boo Yang Jung is a seasoned professional with extensive experience in advanced packaging process development and technology leadership. Currently serving as Team Leader at SK hynix since February 2020, Boo oversees package technology front end processes. Previously, Boo was a Senior Principal Engineer at Skyworks Solutions, leading the development of TC-SAW filters for RF applications. With a background as Senior Member of Technical Staff at GLOBALFOUNDRIES, contributions included 22nm/28nm eMRAM CPI qualifications and SiP FOWLP development. Earlier roles encompass significant positions at the Institute of Microelectronics, Deca Technologies, and Amkor Technology, focusing on wafer level packaging and fan-out technologies across various applications.