At Saras Micro Devices, we are transforming the way power is delivered to advanced semiconductor devices to maximize the computing power for cutting-edge, data-intensive applications like high-performance computing (HPC), artificial intelligence (AI), machine learning (ML), virtual reality (VR), 5G networking and more. 

As packaging experts in the IC world, we understand your power delivery challenges and the technology behind them, and we’ve created a new way to power your innovations. Our novel approach for improving power delivery performance uses 25% less package space, provides clean stable power, and minimizes power waste to deliver better overall efficiency.

When you need packaging expertise to help you reach your power management goals, let us help you power the future. 

Semiconductor

Packaging Services

Saras Micro Devices

Ron Huemoeller

Tiyada Baldwin-Barnes Mls

Carlos Andres Riera Cercado

Jonathon Greenwood

Eelco Bergman

Richard Sheridan

The Leadership Team at Saras Micro Devices is responsible for guiding the overall strategic direction of the company. This team, comprising the VP of People & Culture, President & CEO, Chief Development Officer, Chief Business Officer, and Chief Operations Officer, ensures the alignment of organizational efforts to transform power delivery for advanced semiconductor devices. They oversee business operations, drive innovation, manage company culture, and foster partnerships to maximize computing power for applications including HPC, AI, ML, VR, and 5G networking.

Leadership Team

Engineering Team

Engineering and Product Development

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Leadership Team

About

Team members

Other teams at Saras Micro Devices

Engineering Team

Engineering and Product Development

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Leadership Team

About

Team members

Other teams at Saras Micro Devices

Engineering Team

Engineering and Product Development

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