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Raj Pugo is an experienced professional specializing in IC package design and engineering. Currently serving as the IC Package Design Technical Lead at Presto Engineering, Raj has also held positions such as Packaging Engineer at Cambridge GaN Devices Ltd, Staff Engineer in IC Package Architecture & Design at Qualcomm, and Hardware Design Engineer focusing on IC package design and simulation at Imagination Technologies. Additionally, Raj contributed to package development in an engineering role at Samsung Cambridge Solution Centre. Raj's diverse background underscores a strong expertise in both the technical and architectural aspects of integrated circuit packaging.