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Liang Yew Lin is a seasoned professional in the semiconductor and electronics industry, currently serving as Vice President of R&D at NXP Semiconductors since September 2017. Previously, Liang held various roles at Maxim Integrated, including Managing Director of IC Design, from February 2008 to August 2017, after progressing through several senior positions. Earlier experience includes working as a Staff Engineer at Qualcomm, focusing on power management circuit design, and as a Staff Design Engineer at Conexant, specializing in mixed signal communication circuit design. Liang began a career at Linear Technology as a Design Engineer, dealing with power management and mixed signal circuits. Educational qualifications include a BEng Honors in Electrical and Electronic Engineering from Nanyang Technological University and a Diploma in Electronic Engineering from Ngee Ann Polytechnic.