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Nanette Quevedo has over 30 years of experience in the semiconductor industry, currently serving as a Package Technology Integrator at Micron Technology since October 2010. Responsibilities include package and product qualification for Hybrid Memory Cube technology, conducting technical risk assessments, and engaging in problem-solving related to product and package development. Previously, Nanette led a team as the Assembly Product Engineer Group Leader and held various engineering roles at Intel Corporation, where contributions included managing technical programs and leading process integration for advanced electronic assembly packaging. Nanette began a career as a Senior Process Engineer at TEAM PACIFIC CORPORATION, supervising process engineers and technicians. Nanette holds a Bachelor's degree in Electronics and Communications Engineering from New Era University.