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CL Gan, Ph.D., currently serves as Director at Micron Technology since October 2019, focusing on module and SSD direct materials development and characterization. Previous roles include Senior R&D Engineering Manager at Western Digital, Product Engineering Manager at Broadcom, and FA & Reliability Manager at SanDisk®. CL Gan's extensive experience encompasses packaging materials characterization, materials reliability development, patent filings, package simulation, and new test method development, alongside leadership responsibilities managing a diverse team across multiple countries. With a Ph.D. in Nanoelectronic Engineering from Universiti Malaysia Perlis and additional degrees in Chemical Instrumentation and Chemistry, CL Gan possesses a solid foundation in engineering and reliability studies, with a significant background in NOR Flash memory and semiconductor reliability.