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Filmore Ochoco is an experienced engineering professional specializing in packaging engineering, particularly in RFIC and optical packaging. Since May 2019, Filmore has served as a Principal Packaging Engineer at MACOM. Prior to this role, Filmore was the Manager of Package Development and Assembly at Duet Microelectronics, Inc. from February 2018 to February 2019. Filmore also held the position of Manager for Assembly Process Engineering at II-VI OptoElectronic Devices from February 2016 to February 2018 and was the Manager for I.C. Assembly & Packaging at ANADIGICS from July 1993 to February 2016.